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 PD-93921
RIC7113L4
RADIATION HARDENED HIGH AND LOW SIDE GATE DRIVER
Features
n Total dose capability to 100K Rad (Si) n Floating channel designed for bootstrap operation n Fully operational to +400V n Tolerant to negative transient voltage n dV/dt immune n Gate drive supply range from 10 to 20V n Undervoltage lockout for both channels n Separate logic supply range from 5 to 20V Logic and power ground 5V offset n CMOS Schmitt-triggered inputs with pull-down n Cycle by cycle edge-triggered shutdown logic n Matched propagation delay for both channels n Outputs in phase with inputs
Product Summary
VOFFSET IO+/VOUT ton/off (typ.) Delay Matching(typ.) 400V max. 2A / 2A 10 - 20V 120 & 100 ns 5 ns
Description
The RIC7113L4 is a high voltage, high speed power MOSFET and IGBT driver with independent high and low side referenced output channels. Proprietary HVIC and latch immune CMOS technologies enable ruggedized monolithic construction. Logic inputs are compatible with standard CMOS or LSTTL outputs. The output drivers feature n Hermetically Sealed a high pulse current buffer stage designed for minimum driver cross-conduction. Propagation delays are matched n Lightweight to simplify use in high frequency applications. The floating channel can be used to drive an N-channel power MOSFET or IGBT in the high side configuration which operates up to 400 volts. Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured under board mounted and still air
Absolute Maximum Ratings
conditions.
Symbol
VB VS VHO VCC VLO VDD VSS VIN dVs/dt PD RthJA TJ TS TL
Parameter
High Side Floating Supply Voltage High Side Floating Supply Offset Voltage High Side Floating Output Voltage Low Side Fixed Supply Voltage Low Side Output Voltage Logic Supply Voltage Logic Supply Offset Voltage Logic Input Voltage (HIN, LIN & SD) Allowable Offset Supply Voltage Transient (Figure 2) Package Power Dissipation @ TA +25C Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature Lead Temperature (Soldering, 10 seconds) Weight
Min.
-0.5 -- VS - 0.5 -0.5 -0.5 -0.5 VCC - 20 VSS - 0.5 -- -- -- -55 -55 --
Max.
VS + 20 400 VB + 0.5 20 VCC + 0.5 VSS + 20 VCC + 0.5 VDD + 0.5 50 1.6 125 125 150 300
Units
V
V/ns W C/W C g
1.3 (typical)
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1
5/4/2000
RIC7113L4
Pre-Irradiation
Recommended Operating Conditions
The Input/Output logic timing diagram is shown in Figure 1. The VS and VSS offset ratings are tested with all supplies biased at 15V differential. Symbol
VB VS VHO VCC VLO VDD VSS VIN
Parameter
High Side Floating Supply Absolute Voltage High Side Floating Supply Offset Voltage High Side Floating Output Voltage Low Side Fixed Supply Voltage Low Side Output Voltage Logic Supply Voltage Logic Supply Offset Voltage Logic Input Voltage (HIN, LIN & SD)
Min.
VS + 10 -4 VS 10 0 VSS + 5 -5 VSS
Max.
VS + 20 400 VB 20 VCC VSS + 20 5 VDD
Units
V
Dynamic Electrical Characteristics
VBIAS (VCC, VBS, VDD) = 15V, and VSS = COM unless otherwise specified. The dynamic electrical characteristics are measured using the test circuit shown in Figure 3. Tj = 25C Symbol
ton t off tsd tr tf MT
Parameter
Turn-On Propagation Delay Turn-Off Propagation Delay Shutdown Propagation Delay Turn-On Rise Time Turn-Off Fall Time Delay Matching, HS & LS Turn-On/Off
Min.
-- -- -- -- -- --
Tj = -55 to 125C Typ. Max. Min. Max. Units
120 100 110 25 17 5 150 125 140 35 25 20 -- -- -- -- -- -- 260 220 235 50 40 --
Test Conditions
VS = 0V VS = 400V VS = 400V CL = 1000pf CL = 1000pf |Hton-Lton| or|Htoff-Ltoff|
ns
Typical Connection
4 up to 500V
HO VDD HIN SD LIN V SS VCC VDD HIN SD LIN VSS VCC COM LO VB VS TO LOAD
2
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Pre-Irradiation
RIC7113L4
Static Electrical Characteristics
VBIAS (VCC, VBS, VDD) = 15V, unless otherwise specified. The VIN, VTH and IIN parameters are referenced to VSS and are applicable to all three logic input pins: HIN, LIN and SD. The VO and IO parameters are referenced to COM or VS and are applicable to the respective output pins: HO or LO. Tj = 25C Symbol
VIH
Parameter
Logic "1" Input Voltage
Min.
3.1 6.4 9.5 12.5
Typ.
-- -- -- -- 1.8 3.8 6.0 8.3 1.2 0.1 50 230 340 30 40 1.0 9.7 9.4 9.6 9.4 -- --
Tj = -55 to 125C Min. Max. Units
3.3 6.8 10 13.3 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 1.7 3.6 5.7 7.9 1.5 0.1 250 500 600 60 70 10 -- -- -- -- -- A -- V A V V
Test Conditions
V DD = 5V VDD = 10V VDD = 15V VDD = 20V VDD = 5V VDD = 10V VDD = 15V VDD = 20V VIN =VIH, IO = 0A VIN =VIH, IO = 0A VB = VS = 400V VIN =0V or VDD VIN =0V, or VDD V IN =0V, or VDD VIN = VDD VIN = 0V
VIL
Logic "0" Input Voltage
-- -- -- --
VOH VOL ILK IQBS IQCC IQDD IIN+ IINVBSUV+ VBSUVVCCUV+ VCCUVIO+ IO-
High Level Output Voltage, VBIAS - VO Low Level Output Voltage, VO Offset Supply Leakage Current Quiescent VBS Supply Current Quiescent VCC Supply Current Quiescent VDD Supply Current Logic "1" Input Bias Current Logic "0" Input Bias Current VBS Supply Undervoltage Positive Going Threshold VBS Supply Undervoltage Negative Going Threshold VCC Supply Undervoltage Positive Going Threshold VCC Supply Undervoltage Negative Going Threshold Output High Short Circuit Pulsed Current Output Low Short Circuit Pulsed Current
-- -- -- -- -- -- -- -- 7.5 7.0 7.4 7.0 2.0 2.0
VO = 0V, VIN = VDD PW 10 s VO = 15V, VIN = 0V PW 10 s
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RIC7113L4
Radiation Performance
Radiation characteristics
International Rectifier Radiation Hardened gate drivers are tested to verify their hardness capability. The hardness assurance program at International rectifier uses a Cobalt-60 (60 Co) source and heavy ion irradiation. Every wafer shall be tested per MIL-STD-883, Method 1019, test condition A "Ionizing Radiation (Total Dose) Test Procedure". Both pre- and post- irradiation performances are tested and specified using the same drive circuitry and test conditions to provide a direct comparison. For Static Irradiation Test Conditions refer to figure 7.
Static Electrical Characteristics
Symbol
VIH
Tj = 25C
100K Rads (Si)
Parameter
Logic "1" Input Voltage
Units
Test Conditions
VDD = 5V VDD = 10V VDD = 15V VDD = 20V VDD = 5V VDD = 10V VDD = 15V VDD = 20V VIN =VIH, IO = 0A VIN =VIH, IO = 0A VB =VS = 400A VIN =0V or VDD VIN =0V or VDD VIN =0V or VDD VIN =VDD VIN =0V
Min
3.1 6.4 9.5 12.5 -- -- -- VOH VOL ILK IQBS IQCC IQDD IIN+ IINVBSUV+ VBSUVVCCUV+ VCCUVIO+ IOHigh Level Output Voltage, VBIAS - VO Low Level Output Voltage, VO Offset Supply Leakage Current Quiescent VBS Supply Current Quiescent VCC Supply Current Quiescent VDD Supply Current Logic "1" Input Bias Current Logic "0" Input Bias Current VBS Supply Undervoltage Positive Going Threshold VBS Supply Undervoltage Negative Going Threshold VCC Supply Undervoltage Positive Going Threshold VCC Supply Undervoltage Negative Going Threshold Output High Short Circuit Pulsed Current Output Low Short Circuit Pulsed Current --
Max
-- -- -- -- 1.8 3.8 6.0 8.3 1.2 0.1 50 230 340 30 40 1.0 9.7 9.4 9.6 9.4 V A V
VIL
Logic "0" Input Voltage
V
-- -- -- -- -- -- --
7.5 7.0 7.4 7.0 2.0 2.0
-- --
A
VO =0V, VIN =VDD PW 10 s VO =15V, VIN =0V PW 10 s
4
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Radiation characteristics
RIC7113L4
International Rectifier radiation hardened Gate Drivers have been characterized in heavy ion environment for Single Event Effects (SEE). Single Event Effects characterization data is illustrated below. For Static Bias Test Conditions refer to figure 8.
Single Event Effect Safe Operating Area
Ion Br I Au I Au LET MeV/(mg/cm2)) 37 60 82 85 100 Energy (MeV) 284 344 346 344 346 Angle (degrees) 0 0 0 45 35 VS (V) @VBS=-10V 400 325 250 400 400 @VBS=-15V 400 250 200 400 400 @VBS=-17.5V 400 200 175 350 350
Note: VCC/VDD = 20V, except for LET=100, then VCC/VDD = 17.5V
STATIC BIAS
450 400 350 300 250 200 150 100 50 0 -10 -15 VB (V) -17.5
Br, 0 angle I, 0 angle Au, 0 angle I, 45 angle Au, 35 angle
VS (V)
Single Event Effect, Safe Operating Area
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RIC7113L4
HV = 10 to 400V
RIC7113
IRF820A
Figure 1. Input/Output Logic Timing Diagram
Figure 2. Floating Supply Voltage Transient Test Circuit
0 o 0V ( t 40)
RIC7113
HIN LIN
ton
50%
50%
tr 90%
toff 90%
tf
HO LO
Figure 3. Switching Time Test Circuit
10%
10%
Figure 4. Switching Time Waveform Definition
HIN LIN
50%
50%
SD
50%
LO
HO
10%
tsd
MT
MT 90%
HO LO
90%
LO
Figure 5. Shutdown Waveform Definitions
HO
Figure 6. Delay Matching Waveform Definitions
6
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RIC7113L4
RIC7113 4K VDD VB
4K
HO HIN VS Logic LIN 50 SD COM VCC LO
1 nF
20V
20V
2.4K 1 nF 400V
VSS
4K
Figure 7. Static Bias Conditions for Total Ionizing Dose Test
RIC7113L4
SCHEMATIC 2
Figure 8. Static Bias Conditions for Single Event Effect Test
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7
RIC7113L4
Functional Block Diagram
V V DD R HIN S Q V /V DD CC LEVEL SHIFT
HV LEVEL SHIFT
B
UV DETECT PULSE FILTER
R R S
Q HO
PULSE GEN
VS
SD UV DETECT
V CC
LIN S R V SS Q
V /V DD CC LEVEL SHIFT
LO DELAY COM
Lead Definitions
Lead Symbol Description
VDD HIN SD LIN VSS VB HO VS VCC LO COM Logic supply Logic input for high side gate driver output (HO), in phase Logic input for shutdown Logic input for low side gate driver output (LO), in phase Logic ground High side floating supply High side gate drive output High side floating supply return Low side supply Low side gate drive output Low side return
8
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RIC7113L4 Case Outline and Dimensions -- MO-036AB package
RIC7113L4
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 IR EUROPEAN REGIONAL CENTRE: 439/445 Godstone Rd, Whyteleafe, Surrey CR3 OBL, UK Tel: ++ 44 (0)20 8645 8000 IR CANADA: 15 Lincoln Court, Brampton, Ontario L6T3Z2, Tel: (905) 453 2200 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 (0) 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 011 451 0111 IR JAPAN: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo 171 Tel: 81 (0)3 3983 0086 IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower, 13-11, Singapore 237994 Tel: ++ 65 (0)838 4630 IR TAIWAN:16 Fl. Suite D. 207, Sec. 2, Tun Haw South Road, Taipei, 10673 Tel: 886-(0)2 2377 9936 Data and specifications subject to change without notice. 5/00
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